Microstructure Evolution of Sn-35Bi-1Ag/Ni-P/Cu Solder Joints During Post-reflow Cooling and Isothermal Aging

Han-qiao LU, Yu-long LI, Xiao YU, Wei-feng LONG, Jian-feng JIANG

Journal of Materials Engineering ›› 2018, Vol. 46 ›› Issue (6) : 95-100.

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Journal of Materials Engineering ›› 2018, Vol. 46 ›› Issue (6) : 95-100. DOI: 10.11868/j.issn.1001-4381.2017.000412
RESEARCH ARTICLE

Microstructure Evolution of Sn-35Bi-1Ag/Ni-P/Cu Solder Joints During Post-reflow Cooling and Isothermal Aging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2018, 46(6): 95-100 https://doi.org/10.11868/j.issn.1001-4381.2017.000412

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