Effect of particle size and content of SiO2 solvent-free nanofluid on mechanical and thermal properties of epoxy resin

Yu-deng WANG, Ya-ping ZHENG, Shan SONG, Dong-dong YAO

Journal of Materials Engineering ›› 2021, Vol. 49 ›› Issue (10) : 156-163.

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Journal of Materials Engineering ›› 2021, Vol. 49 ›› Issue (10) : 156-163. DOI: 10.11868/j.issn.1001-4381.2020.000997
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Effect of particle size and content of SiO2 solvent-free nanofluid on mechanical and thermal properties of epoxy resin

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2021, 49(10): 156-163 https://doi.org/10.11868/j.issn.1001-4381.2020.000997

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