Microstructure and mechanical property of full Cu3Sn solder joints during high-temperature aging

Yangyang ZHU, Xiaoyan LI, Weidong ZHANG, Hu ZHANG, Xi HE

Journal of Materials Engineering ›› 2022, Vol. 50 ›› Issue (9) : 169-176.

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Journal of Materials Engineering ›› 2022, Vol. 50 ›› Issue (9) : 169-176. DOI: 10.11868/j.issn.1001-4381.2021.000977
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Microstructure and mechanical property of full Cu3Sn solder joints during high-temperature aging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 50(9): 169-176 https://doi.org/10.11868/j.issn.1001-4381.2021.000977

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