Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper

Chao CUI, Lili YUAN, Liang YIN, Yudong HUANG, Linghui MENG, Nianqun YANG, Shiyong YANG

Journal of Materials Engineering ›› 2022, Vol. 50 ›› Issue (10) : 128-138.

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Journal of Materials Engineering ›› 2022, Vol. 50 ›› Issue (10) : 128-138. DOI: 10.11868/j.issn.1001-4381.2021.001095
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Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2022, 50(10): 128-138 https://doi.org/10.11868/j.issn.1001-4381.2021.001095

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