Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy

SU Lidong, MENG Qingqi, NING Yongquan, HUANG Shuo, ZHANG Wenyun, ZHANG Beijiang

Journal of Materials Engineering ›› 2025, Vol. 53 ›› Issue (1) : 99-109.

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Journal of Materials Engineering ›› 2025, Vol. 53 ›› Issue (1) : 99-109. DOI: 10.11868/j.issn.1001-4381.2023.000846

Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 53(1): 99-109 https://doi.org/10.11868/j.issn.1001-4381.2023.000846

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