Effect of substrate material on stress of electroplated copper film

JIANG Yingyu, SHI Guanghua, XU Da, WANG Zhen

Journal of Materials Engineering ›› 2025, Vol. 53 ›› Issue (12) : 250-255.

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Journal of Materials Engineering ›› 2025, Vol. 53 ›› Issue (12) : 250-255. DOI: 10.11868/j.issn.1001-4381.2024.000658

Effect of substrate material on stress of electroplated copper film

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 53(12): 250-255 https://doi.org/10.11868/j.issn.1001-4381.2024.000658

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