Research progress in low-temperature solders for electronic packaging

LI Fangliang, GAN Guisheng, DOU Junfeng, XIE Daochun, ZHU Junxiong, GENG Mingli, HAN Jun, YANG Donghua, PAN Hao, XIA Daquan, XU Xiangtao

Journal of Materials Engineering ›› 2025, Vol. 53 ›› Issue (9) : 11-28.

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Journal of Materials Engineering ›› 2025, Vol. 53 ›› Issue (9) : 11-28. DOI: 10.11868/j.issn.1001-4381.2025.000001

Research progress in low-temperature solders for electronic packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 53(9): 11-28 https://doi.org/10.11868/j.issn.1001-4381.2025.000001

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