Influence of Preparation Parameter on Microstructure of Cu/Si Gradient Layer Section on Copper Surface

LI Yun-gang, TIAN Wei, FANG Xiu-jun

Journal of Materials Engineering ›› 2013, Vol. 0 ›› Issue (2) : 65-68,98.

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Journal of Materials Engineering ›› 2013, Vol. 0 ›› Issue (2) : 65-68,98. DOI: 10.3969/j.issn.1001-4381.2013.02.013

Influence of Preparation Parameter on Microstructure of Cu/Si Gradient Layer Section on Copper Surface

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2013, 0(2): 65-68,98 https://doi.org/10.3969/j.issn.1001-4381.2013.02.013

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