Synthesis and Properties of Single-component Epoxy Adhesive Containing Microcapsule-type Latent Curing Agent

SHI You-qiang, ZHANG Qiu-yu, HE Shan, WANG Zhi-yong, QI Yu

Journal of Materials Engineering ›› 2013, Vol. 0 ›› Issue (11) : 32-37.

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Journal of Materials Engineering ›› 2013, Vol. 0 ›› Issue (11) : 32-37. DOI: 10.3969/j.issn.1001-4381.2013.11.006

Synthesis and Properties of Single-component Epoxy Adhesive Containing Microcapsule-type Latent Curing Agent

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2013, 0(11): 32-37 https://doi.org/10.3969/j.issn.1001-4381.2013.11.006

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