Effect of Thermal Cycles on the Interface and Property of SnAgCu(nano-Al)/Cu Solder Joints

ZHANG Liang, HAN Ji-guang, HE Cheng-wen, GUO Yong-huan, ZHANG Jian

Journal of Materials Engineering ›› 2014, Vol. 0 ›› Issue (3) : 55-59.

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Journal of Materials Engineering ›› 2014, Vol. 0 ›› Issue (3) : 55-59. DOI: 10.3969/j.issn.1001-4381.2014.03.010

Effect of Thermal Cycles on the Interface and Property of SnAgCu(nano-Al)/Cu Solder Joints

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 0(3): 55-59 https://doi.org/10.3969/j.issn.1001-4381.2014.03.010

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