High Temperature Creep Behaviour of a Directionally Solidified Ni3Al Base Alloy IC6

Xiao Chengbo, Han Yafang, Yin Keqin, Zhao Xihong

Journal of Materials Engineering ›› 1996, Vol. 0 ›› Issue (3) : 6-8,32.

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Journal of Materials Engineering ›› 1996, Vol. 0 ›› Issue (3) : 6-8,32.
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High Temperature Creep Behaviour of a Directionally Solidified Ni3Al Base Alloy IC6

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 1996, 0(3): 6-8,32

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