×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
×
Toggle navigation
中文
RSS
E-mail Alert
Ei，ESCI
收录期刊
中国科学引文数据库(CSCD)核心期刊
中文核心期刊
文摘与引文数据库(Scopus)
剑桥科学文摘(CSA)
Toggle navigation
Home
About Journal
About Journal
About Sponsor
Editorial Board
Open Access
Author Guidelines
Instruction for Authors
Paper Template
Reference Template
Author's Statement
Copyright Agreement
Browse
Just Accepted
Current Issue
Online First
Archive
Topic
Special Issue
Recommended Articles
Most Article
Most Viewed
Most Download
Most Cited
Subscribe
Contact Us
Influences of Slurry Pack Cementation Time on Microstructure and Properties of Ni-Al Coating on Cu Substrate
WANG Hong-xing, SHENG Xiao-bo, CHU Cheng-lin, DONG Yin-sheng, LIN Ping-hua
Journal of Materials Engineering . 2008, (
8
): 52 -56 .
