• Ei，ESCI收录期刊
  • 中国科学引文数据库(CSCD)核心期刊
  • 中文核心期刊
  • 文摘与引文数据库(Scopus)
  • 剑桥科学文摘(CSA)
Research Development of SnAgCu System Lead-free Solders in Electronics Packing
CHEN Jian-xun, ZHAO Xing-ke, LIU Da-yong, HUANG Ji-hua, ZOU Xu-chen
Journal of Materials Engineering . 2013, (9): 91 -98 .  DOI: 10.3969/j.issn.1001-4381.2013.09.018