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材料工程  2017, Vol. 45 Issue (2): 17-23    DOI: 10.11868/j.issn.1001-4381.2015.000528
  研究论文 本期目录 | 过刊浏览 | 高级检索 |
SiCP/Al-Cu复合材料的高温热变形行为
程明阳1, 郝世明2, 谢敬佩3,4, 王爱琴3,4, 马窦琴3,4, 孙亚丽3
1 中国空空导弹研究院, 河南 洛阳 471000;
2 河南科技大学 物理工程学院, 河南 洛阳 471023;
3 河南科技大学 材料科学与工程学院, 河南 洛阳 471023;
4 有色金属共性技术河南省协同创新中心, 河南 洛阳 471023
Hot Deformation Behavior of SiCP/A1-Cu Composite
CHENG Ming-yang1, HAO Shi-ming2, XIE Jing-pei3,4, WANG Ai-qin3,4, MA Dou-qin3,4, SUN Ya-li3
1 China Airborne Missile Academy, Luoyang 471000, Henan, China;
2 School of Physics and Engineering, Henan University of Science and Technology, Luoyang 471023, Henan, China;
3 School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, Henan, China;
4 Collaborative Innovation Center of Non-ferrous Materials of Henan Province, Luoyang 471023, Henan, China
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摘要 利用Gleeble-1500D热模拟试验机对SiCp/Al-Cu复合材料进行压缩实验,研究其在温度为350~500℃、应变速率为0.01~10s-1条件下的高温塑性变形行为。由实验得出变形过程中的应力-应变曲线,建立了热变形本构方程和加工图。结果表明:复合材料高温流动应力-应变曲线主要以动态再结晶为特征,峰值应力随变形温度的降低或应变速率的升高而增加。其热压缩变形时的流变应力可采用Zener-Hollomon参数的双曲正弦形式来描述,在实验条件下平均热变形激活能Q为320.79kJ/mol。确定了加工图中的稳定区和失稳区,分析了加工图中不同区域的显微组织结构,失稳区存在颗粒破裂、孔洞等。
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程明阳
郝世明
谢敬佩
王爱琴
马窦琴
孙亚丽
关键词 SiCp/Al-Cu复合材料热变形应力-应变曲线本构方程加工图显微组织    
Abstract:Using the Gleeble-1500D simulator, the high temperature plastic deformation behavior of SiCp/Al-Cu composite were investigated at 350-500℃ with the strain rate of 0.01-10s-1. The true stress-strain curves were obtained in the tests. Constitutive equation and processing map were established. The results show that the softening mechanism of dynamic recrystallization is a feature of high-temperature flow stress-strain curves of SiCp/A1-Cu composite, and the peak stress increases with the decrease of deformation temperature or the increase of strain rate.The flow stress behavior of the composite during hot compression deformation can be represented by a Zener-Hollomon parameter in the hyperbolic sine form. Its activation energy for hot deformation Q is 320.79kJ/mol. The stable regions and the instability regions in the processing map were identified and the microstructures in different regions of processing map were studied.There are particle breakage and void in the instability regions.
Key wordsSiCp/Al-Cu composite    hot deformation    stress-strain curve    constitutive equation    processing map    microstructure
收稿日期: 2015-04-29      出版日期: 2017-02-23
中图分类号:  TB333  
通讯作者: 谢敬佩(1957-),男,教授,博导,从事专业:金属材料的凝固组织控制及强韧化,联系地址:河南省洛阳市开元大道263号河南科技大学校长办公室(471023),xiejp@haust.edu.cn     E-mail: xiejp@haust.edu.cn
引用本文:   
程明阳, 郝世明, 谢敬佩, 王爱琴, 马窦琴, 孙亚丽. SiCP/Al-Cu复合材料的高温热变形行为[J]. 材料工程, 2017, 45(2): 17-23.
CHENG Ming-yang, HAO Shi-ming, XIE Jing-pei, WANG Ai-qin, MA Dou-qin, SUN Ya-li. Hot Deformation Behavior of SiCP/A1-Cu Composite. Journal of Materials Engineering, 2017, 45(2): 17-23.
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http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2015.000528      或      http://jme.biam.ac.cn/CN/Y2017/V45/I2/17
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