2A12与2A11铝合金超声波焊接工艺与组织研究

doi:10.11868/j.issn.1001-4381.2015.03.010

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摘要

对2A12-T3 和2A11-O铝合金进行了超声波焊接,研究了不同超声波焊接工艺参数对焊接界面结合状况的影响。采用扫描电镜、电子背散射衍射和透射电镜研究了焊接界面的组织结构。结果表明,当超声波焊接振幅为30μm,焊接时间为0.2s,焊接界面结合状况较好,焊接界面的线性焊接密度接近100%。氩气保护也会对线性焊接密度产生影响。当焊接振幅为15μm时,氩气保护可提高线性焊接密度;但当焊接振幅为30μm, 氩气保护对线性焊接密度无明显影响。超声波焊接过程中,焊接界面上产生波纹和漩涡状塑性流动,发生动态回复和连续动态再结晶,形成由位错缠结、位错胞、亚晶和细小晶粒组成的焊接界面组织。

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	谢俊峰
	朱有利
	黄元林
	白昶

关键词 ：超声波焊接, 线性焊接密度, 氩气保护, 塑性流动, 连续动态再结晶

Abstract：

Ultrasonic welding of 2A12-T3 and 2A11-O aluminum alloy was carried out and effects of ultrasonic welding parameters on the welded interface bonding were studied. The welded interface microstructure was investigated via scanning electron microscope (SEM), electron backscatter diffraction (EBSD) and transmission electron microscope (TEM). Results show that favorable welded interface bonding with a linear weld density approaching 100% is obtained at ultrasonic welding vibration amplitude of 30μm and welding duration of 0.2s. Argon shield shows influence on the linear weld density. When the vibration amplitude is 15m, argon shield can improve the linear weld density; when the vibration amplitude is 30m, argon shield has no obvious influence on the linear weld density. Ultrasonic welding bring about ripple or vortices plastic flow at the welded interface, with accompanying dynamic recovery and continuous dynamic recrystallization, which result in the welded interface microstructure consisting of dislocation tanglings, dislocation cells, sub-grains and fine grains.

Key words： ultrasonic welding linear weld density argon shield plastic flow continuous dynamic recrystallization

收稿日期: 2013-06-09 出版日期: 2015-03-20

基金资助:北京市自然科学基金资助项目(3093027)

通讯作者: 朱有利 E-mail: youlizhu@sina.com

作者简介: 朱有利(1962-),男,教授,主要从事疲劳延寿技术研究,联系地址:北京市长辛店杜家坎21号装甲兵工程学院装备再制造系313 (100072),E-mail:youlizhu@sina.com

引用本文:

谢俊峰, 朱有利, 黄元林, 白昶. 2A12与2A11铝合金超声波焊接工艺与组织研究[J]. 材料工程, 2015, 43(3): 54-59.
Jun-feng XIE, You-li ZHU, Yuan-lin HUANG, Chang BAI. Researches on Process and Microstructure of 2A12 and 2A11 Aluminum Ultrasonic Welds. Journal of Materials Engineering, 2015, 43(3): 54-59.

链接本文:

http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2015.03.010 或 http://jme.biam.ac.cn/CN/Y2015/V43/I3/54

Table 1 超声波焊接工艺参数

Fig.1 不同工艺焊接界面扫描电镜照片
(a)工艺1;(b)工艺2; (c)工艺3; (d)工艺4

Fig.2 焊接界面缺陷层扫描电镜和能谱分析
(a)缺陷层形貌;(b)缺陷层能谱分析

Fig.3 工艺1焊接界面上的结合区

Fig.4 工艺1焊接界面上的微结合区

Fig.5 工艺1焊接界面上的漩涡

Fig.6 工艺4焊接界面形貌的扫描电镜照片

Fig.7 工艺4超声波焊接试样的EBSD晶界分布图
(a)原始箔材；(b)原始母材；(c)焊接界面区域

Fig.8 工艺4焊接界面微观组织的透射电镜照片
(a)焊接界面；(b)箔材与母材之间的结合晶界

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