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材料工程  2015, Vol. 43 Issue (4): 79-84    DOI: 10.11868/j.issn.1001-4381.2015.04.014
  材料与工艺 本期目录 | 过刊浏览 | 高级检索 |
液相化学还原法制备纳米银焊膏及其连接性
曹洋1,2, 刘平1, 魏红梅2, 林铁松2, 何鹏2, 顾小龙1
1. 浙江省冶金研究院有限公司 浙江省钎焊材料与技术重点实验室, 杭州 310030;
2. 哈尔滨工业大学 先进焊接与连接国家重点实验室, 哈尔滨 150001
Synthesis of Silver Nanoparticles Paste by Aqueous Reduction and Its Connectivity
CAO Yang1,2, LIU Ping1, WEI Hong-mei2, LIN Tie-song2, HE Peng2, GU Xiao-long1
1. Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310030, China;
2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
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摘要 采用液相化学还原法制备出平均粒径为20~35nm的纳米银,并考察不同温度及PVP用量对纳米银性质的影响。结果表明:当硝酸银与PVP的质量比为1:4、反应温度为30℃时,纳米银的平均粒径最小,为22.4nm,且其团聚程度最小,粒径分布最佳。在压力10MPa、温度200℃、保温30min的烧结条件下,利用制得的纳米银配制焊膏,连接纯度为99.9%的无氧紫铜板,通过扫描电镜(SEM)观察烧结接头截面形貌,可见烧结界面连接紧密,接头组织有孔隙存在。
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曹洋
刘平
魏红梅
林铁松
何鹏
顾小龙
关键词 纳米银液相化学还原法低温连接    
Abstract:Silver nanoparticles with average diameter of 20-35nm were prepared by aqueous reduction method, and the influence factors of nanoparticles characteristics, such as reaction temperature and PVP concentration, were investigated during reduction process. The results show that monodispersity of nanoparticles is remarkably improved while unfavorable agglomeration is avoided with the AgNO3/PVP mass ratio of 1:4 at the reaction temperature 30℃,and the average diameter of silver nanoparticles reaches the mininum of 22.4nm. Copper pads with the purity of 99.9% are successfully bonded at 200℃ and under the pressure of 10MPa for 30min,using sintering paste employing fresh silver nanoparticles. Morphology of the bonding joint is analyzed with scanning electron microscope(SEM),the interface is compacted tightly and porous sintering characteristic is confirmed.
Key wordssilver nanoparticle    aqueous chemical reduction    low-temperature sintering
收稿日期: 2013-11-04     
1:  TG425+.1  
基金资助:国家自然科学基金资助项目(51275135,51321061)
通讯作者: 何鹏(1972-),男,教授,博士生导师,从事专业:钎焊、微连接及可靠性基础理论与实际应用技术, 联系地址:黑龙江省哈尔滨市南岗区哈尔滨工业大学材料楼824(150001),hepeng@hit.edu.cn     E-mail: hepeng@hit.edu.cn
引用本文:   
曹洋, 刘平, 魏红梅, 林铁松, 何鹏, 顾小龙. 液相化学还原法制备纳米银焊膏及其连接性[J]. 材料工程, 2015, 43(4): 79-84.
CAO Yang, LIU Ping, WEI Hong-mei, LIN Tie-song, HE Peng, GU Xiao-long. Synthesis of Silver Nanoparticles Paste by Aqueous Reduction and Its Connectivity. Journal of Materials Engineering, 2015, 43(4): 79-84.
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http://jme.biam.ac.cn/jme/CN/10.11868/j.issn.1001-4381.2015.04.014      或      http://jme.biam.ac.cn/jme/CN/Y2015/V43/I4/79
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