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材料工程  2018, Vol. 46 Issue (8): 106-112    DOI: 10.11868/j.issn.1001-4381.2017.000141
  研究论文 本期目录 | 过刊浏览 | 高级检索 |
微电子封装中全Cu3Sn焊点形成过程中的组织演变及生长形貌
梁晓波, 李晓延, 姚鹏, 李扬, 金凤阳
北京工业大学 材料科学与工程学院 新型功能材料教育部重点实验室, 北京 100124
Microstructural Evolution and Growth Morphology During Formation Process of Full Cu3Sn Solder Joint in Microelectronic Packaging
LIANG Xiao-bo, LI Xiao-yan, YAO Peng, LI Yang, JIN Feng-yang
Key Laboratory of Advanced Functional Materials of Ministry of Education, College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
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摘要 在3D封装中,全Cu3Sn焊点逐渐得到广泛应用。选择270℃,1N分别作为钎焊温度和钎焊压力,在不同钎焊时间下制备焊点,分析其组织演变过程,分别观察不同钎焊温度和钎焊时间下Cu6Sn5立体形貌,以研究Cu6Sn5生长规律及温度对其生长形貌的影响。结果表明:钎焊30min后Cu基板与液态Sn之间形成扇贝状Cu6Sn5,Cu6Sn5与Cu基板之间出现一层较薄的Cu3Sn。当钎焊时间增加到60min后,液态Sn全部被消耗,上下两层Cu6Sn5形成一个整体。继续增加钎焊时间,Cu3Sn以Cu6Sn5的消耗为代价不断长大,直到480min时Cu6Sn5全部转化成Cu3Sn。Cu6Sn5长大增厚过程为表面形核、长大、小晶粒融合、包裹初始大晶粒。随着钎焊温度的增加,Cu6Sn5的形貌逐渐由多面体状变为匍匐状。
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梁晓波
李晓延
姚鹏
李扬
金凤阳
关键词 Cu3Sn焊点Cu6Sn5组织演变形貌    
Abstract:The full Cu3Sn solder joint has been widely used in 3D packaging gradually. 270℃ and 1N were chosen as soldering temperature and pressure respectively to fabricate solder joints under different soldering time in order to analyze the process of microstructural evolution.Cu6Sn5 morphology with different soldering temperatures and time was also observed respectively to investigate the growth law of Cu6Sn5 and the effect of soldering temperature on the Cu6Sn5 morphology. The results show that scallop-like Cu6Sn5 is formed along the Cu substrate after 30min soldering, and a thin layer of Cu3Sn is generated between Cu6Sn5 and Cu substrate.When the soldering time is increased to 60min, liquid Sn is totally consumed and Cu6Sn5 becomes a cohesive whole. With the increase of soldering time, Cu3Sn grows at the expense of Cu6Sn5. Cu6Sn5 is totally transformed into Cu3Sn up to 480min. The growing process of Cu6Sn5 includes nucleation, growth, fusion and covering up the big grain. With the increase of soldering temperature, the morphology of Cu6Sn5 changes from polyhedron shape to procumbent.
Key wordsCu3Sn solder joint    Cu6Sn5    microstructural evolution    morphology
收稿日期: 2017-02-12      出版日期: 2018-08-17
中图分类号:  TG406  
通讯作者: 李晓延(1963-),男,博士,教授,现主要从事微电子组装材料,高性能焊接材料等方面的研究,联系地址:北京市朝阳区平乐园100号北京工业大学材料科学与工程学院(100124),E-mail:xyli@bjut.edu.cn     E-mail: xyli@bjut.edu.cn
引用本文:   
梁晓波, 李晓延, 姚鹏, 李扬, 金凤阳. 微电子封装中全Cu3Sn焊点形成过程中的组织演变及生长形貌[J]. 材料工程, 2018, 46(8): 106-112.
LIANG Xiao-bo, LI Xiao-yan, YAO Peng, LI Yang, JIN Feng-yang. Microstructural Evolution and Growth Morphology During Formation Process of Full Cu3Sn Solder Joint in Microelectronic Packaging. Journal of Materials Engineering, 2018, 46(8): 106-112.
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http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2017.000141      或      http://jme.biam.ac.cn/CN/Y2018/V46/I8/106
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