Effects of minor Hf on high temperature stress rupture properties of high angle grain boundary in a Re-containing Ni-based bicrystal superalloy
ZHAO Yun-song1, GUO Yuan-yuan1, ZHAO Jing-xuan2, ZHANG Xiao-tie3, LIU Yan-fei1, YANG Yan1, JIANG Hua1, ZHANG Jian1, LUO Yu-shi1
1. Science and Technology on Advanced High Temperature Structural Materials Laboratory, AECC Beijing Institute of Aeronautical Materials, Beijing 100095, China;
2. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China;
3. School of Materials Science and Engineering, Beihang University, Beijing 100083, China
Abstract：Two bicrystal specimens containing high angle grain boundary (about 20 degrees) were prepared by seed crystal method. The effect of Hf on the as-cast, heat-treated grain boundary microstructure, composition and stress rupture properties under 1100℃/100MPa was investigated in Ni-based single crystal superalloy contained Re with different contents of Hf (mass fraction:0%, 0.4%). The results show that Hf addition results in the increase of the volume fraction of (γ+γ') eutectic and MC along the grain boundary. The volume fraction of cellular recrystallization microstructure is significantly decreased after heat treatment with Hf addition. The transverse stress rupture life is observed to increase significantly under 1100℃/100MPa in the Hf-containing alloy. The stress rupture properties are closely related to the type, morphology, content and composition of the precipitation phase along grain boundary, but the obvious segregation of Hf is not observed. This study can be helpful for the understanding of Hf's role of strengthening mechanism in grain boundary in advanced Ni-based single crystal superalloy.
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ZHAO Yun-song, GUO Yuan-yuan, ZHAO Jing-xuan, ZHANG Xiao-tie, LIU Yan-fei, YANG Yan, JIANG Hua, ZHANG Jian, LUO Yu-shi. Effects of minor Hf on high temperature stress rupture properties of high angle grain boundary in a Re-containing Ni-based bicrystal superalloy. Journal of Materials Engineering, 2019, 47(2): 76-83.
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