Influences of Additive and Current Density on the Microstructure of the Electroforming Ni-Co Alloy
PEI He-zhong1, HUANG Pan1, SHI Qing-nan1, LU Feng2, ZHANG Jun3, ZHANG Guo-liang1
1. Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;
2. Beijing Institute of Aeronautical Materials,Beijing 100095,China;
3. Yunnan Chihong Zn&Ge Co.,Ltd.,Kunming 650093,China
Abstract:The influences of additives and current density on the stress and cobalt content of nickel-cobalt alloy electroforming layer were studied. The effects of additives and current density to the morphology and microstructure of nickel-cobalt alloy electroforming layer were investigated by SEM, EDS and X-ray diffraction. The results showed that compressive stress was generated in the electroforming layer when the additive TN2 added in the electroforming solution; the additive TN3 could make tensile stress. So electroforming layer might have a balance of zero stress by adding TN2 and TN3 together. When the current density was less than 6A/dm2, the stress of electroforming layer increased along with the current density; when the current density was greater than 6A/dm2, the stress of electroforming layer decreased along with the current density. The additives’ influence on the cobalt content of electroforming layer was not obvious. The current density’s influence on the cobalt content of electroforming layer was more obvious. Smoother and finer grain could be acquired when the TN2 or TN3 added in the electroforming solution. The additive TN2 had a large effect on the diffraction peak(200)and certain selectivity to the crystal face.The additive TN3 had a strong selectivity to the crystal face, easily adsorbed on the (200) surfaces to inhibit their growth, so the crystal growth direction was mainly [100]. With the current density increasing, the diffraction peak had the widening trend.
裴和中, 黄攀, 史庆南, 陆峰, 张俊, 张国亮. 添加剂和电流密度对镍钴合金电铸层组织结构的影响[J]. 材料工程, 2013, 0(6): 18-24.
PEI He-zhong, HUANG Pan, SHI Qing-nan, LU Feng, ZHANG Jun, ZHANG Guo-liang. Influences of Additive and Current Density on the Microstructure of the Electroforming Ni-Co Alloy. Journal of Materials Engineering, 2013, 0(6): 18-24.
[1] 李松,马立娟.复合材料模具表面电铸镍钴合金研究[J].电镀与涂饰,2006,25(10):1—4.LI Song, MA Li-juan. Study on electroformed nickel-cobalt alloy on the surface of composite mould [J]. Electroplating & Finishing, 2006,25(10):1—4.[2] 李学磊,朱增伟,朱荻.辅助摩擦电铸Ni-Mn合金的力学性能[J].航空材料学报,2011,31(3):65-70.LI Xue-lei,ZHU Zeng-wei,ZHU Di.Mechanical properties of Ni-Mn alloy electroformed with abrasion-assisted method[J].Journal of Aeronautical Materials,2011,31(3):65-70.[3] SRIVASTAVA M, SELVI V E, GRIPS V K W, et al. Corrosion resistance and microstructure of electrodeposited nickel-cobalt alloy coatings [J]. Surface & Coatings Technology, 2006, 201(6): 3051—3060.[4] ORIÑÁKOVÁ R, ORIÑÁK A, VERING G, et al. Influence of pH on the electrolytic deposition of Ni-Co films [J]. Thin Solid Films, 2008, 516(10):3045—3050.[5] 张俊,裴和中,张国亮,等.添加剂及波形对镍钴合金电铸液的分散能力的影响[J].材料保护,2009,42(9):30—32.ZHANG Jun, PEI He-zhong, ZHANG Guo-liang, et al. Affection of additive and waveform on the throwing power of Ni-Co alloy electroforming solution [J]. Materials Protection, 2009,42(9):30—32.[6] TURY B,RADNCZI G Z,RADNCZI G, et al. Microstructure properties of pulse plated Ni-Co alloy [J]. Surface & Coatings Technology, 2007,202(2):331—335.[7] 曾华梁,吴仲达,陈钊武,等.电镀工艺手册[M].北京:机械工业出版社,2002.[8] 肖亚庆.铝加工技术实用手册[M].北京:冶金工业出版社,2005.[9] EL-SHERIK A M, SHIROKOFF J, ERB U.Stress measurements in nanocry stalline Ni electrodeposit [J]. Journal of Alloys and Compounds, 2005, 389(1-2):140—143.[10] 黄子勋,吴纯素.电镀理论[M].北京:中国农业机械出版社,1982.[11] 王伊卿,赵文轸,唐一平,等.Ni-Co合金电铸工艺及性能研究[J].兵器材料科学与工程,2000,23(3):39—43. WANG Yi-qing, ZHAO Wen-zhen, TANG Yi-ping, et al. Study on electroforming processing and properties of Ni-Co alloy [J]. Ordnance Material Science and Engineering, 2000,23(3):39—43.[12] 张芳,荆天辅,乔桂英,等.脉冲电沉积钴镍合金层微观结构的研究[J].电镀与涂饰,2001,20(6):1—3. ZHANG Fang, JING Tian-fu, QIAO Gui-ying.Studies on the microstructure of pulse electrodeposited cobalt- nickel alloy deposits [J].Electroplating & Finishing,2001,20(6):1—3.[13] 许伟长,戴品强,郑耀东.钴含量对电沉积纳米晶镍钴合金组织与力学性能的影响[J].中国有色金属学报,2010,20(1):92—99. XU Wei-chang, DAI Pin-qiang, ZHENG Yao-dong. Effect of Co content on structures and mechanical properties of electrodeposited nanocrystalline Ni-Co alloys [J]. The Chinese Journal of Nonferrous Metals,2010,20(1):92—99.