Influences of Additive and Current Density on the Microstructure of the Electroforming Ni-Co Alloy
PEI He-zhong1, HUANG Pan1, SHI Qing-nan1, LU Feng2, ZHANG Jun3, ZHANG Guo-liang1
1. Faculty of Materials Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;
2. Beijing Institute of Aeronautical Materials,Beijing 100095,China;
3. Yunnan Chihong Zn&Ge Co.,Ltd.,Kunming 650093,China
Abstract：The influences of additives and current density on the stress and cobalt content of nickel-cobalt alloy electroforming layer were studied. The effects of additives and current density to the morphology and microstructure of nickel-cobalt alloy electroforming layer were investigated by SEM, EDS and X-ray diffraction. The results showed that compressive stress was generated in the electroforming layer when the additive TN2 added in the electroforming solution; the additive TN3 could make tensile stress. So electroforming layer might have a balance of zero stress by adding TN2 and TN3 together. When the current density was less than 6A/dm2, the stress of electroforming layer increased along with the current density; when the current density was greater than 6A/dm2, the stress of electroforming layer decreased along with the current density. The additives’ influence on the cobalt content of electroforming layer was not obvious. The current density’s influence on the cobalt content of electroforming layer was more obvious. Smoother and finer grain could be acquired when the TN2 or TN3 added in the electroforming solution. The additive TN2 had a large effect on the diffraction peak(200)and certain selectivity to the crystal face.The additive TN3 had a strong selectivity to the crystal face, easily adsorbed on the (200) surfaces to inhibit their growth, so the crystal growth direction was mainly [100]. With the current density increasing, the diffraction peak had the widening trend.
裴和中, 黄攀, 史庆南, 陆峰, 张俊, 张国亮. 添加剂和电流密度对镍钴合金电铸层组织结构的影响[J]. 材料工程, 2013, 0(6): 18-24.
PEI He-zhong, HUANG Pan, SHI Qing-nan, LU Feng, ZHANG Jun, ZHANG Guo-liang. Influences of Additive and Current Density on the Microstructure of the Electroforming Ni-Co Alloy. Journal of Materials Engineering, 2013, 0(6): 18-24.
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