Recent Progress of Electrically Conductive Adhesives with Nano-fillers
HE Peng1, WANG Jun1, GU Xiao-long2, LIN Tie-song1
1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
2. Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310011, China
Abstract：The effects of nano-fillers on electrically conductive adhesives (ECAs) applied to electronic packaging were theoretically analyzed. Research progress in influencing factors of properties of nano-filler ECAs,such as content, size, shape,surface state of nano-fillers, curing temperature and curing time etc, was reviewed. The methods for improving properties such as in-situ synthesis of nano-fillers and sintering of nano-fillers were emphatically introduced. Main challenges of nano-filler ECAs research were proposed, as the improvement of ECAs properties,such as the electrically and thermally conductive performance, bonding strength and reliability, conductive flexible adhesives, ink-jet adhesives and cost reduction.
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