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材料工程  2013, Vol. 0 Issue (12): 1-7    DOI: 10.3969/j.issn.1001-4381.2013.12.001
  论文 本期目录 | 过刊浏览 | 高级检索 |
纳米填料导电胶研究进展
何鹏1, 王君1, 顾小龙2, 林铁松1
1. 哈尔滨工业大学 先进焊接与连接国家重点实验室, 哈尔滨 150001;
2. 浙江省冶金研究院有限公司 浙江省钎焊材料与技术重点实验室, 杭州 310011
Recent Progress of Electrically Conductive Adhesives with Nano-fillers
HE Peng1, WANG Jun1, GU Xiao-long2, LIN Tie-song1
1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
2. Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310011, China
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摘要 本文从理论上分析了纳米填料在电子封装用导电胶中的作用。从纳米填料含量、粒径、形状与维度、表面状态、固化温度与固化时间等方面综述了纳米填料导电胶性能影响因素的国内外研究进展;重点介绍了纳米填料原位生成、纳米填料烧结等导电胶性能改进技术,探讨了存在的主要问题,并指出进一步提高导电导热性能、粘接强度和可靠性,制备应用于柔性封装、喷墨印刷的导电胶以及降低制备成本是未来纳米填料导电胶研究领域的发展方向。
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关键词 纳米材料导电胶影响因素电子封装    
Abstract:The effects of nano-fillers on electrically conductive adhesives (ECAs) applied to electronic packaging were theoretically analyzed. Research progress in influencing factors of properties of nano-filler ECAs,such as content, size, shape,surface state of nano-fillers, curing temperature and curing time etc, was reviewed. The methods for improving properties such as in-situ synthesis of nano-fillers and sintering of nano-fillers were emphatically introduced. Main challenges of nano-filler ECAs research were proposed, as the improvement of ECAs properties,such as the electrically and thermally conductive performance, bonding strength and reliability, conductive flexible adhesives, ink-jet adhesives and cost reduction.
Key wordsnano-material    ECAs    influencing factor    electronic packaging
收稿日期: 2012-12-14      出版日期: 2013-12-20
中图分类号:  TQ43  
基金资助:国家自然科学基金资助项目(51105107,51021002,51275135);黑龙江省自然科学基金资助项目(QC2011C044);高等学校博士学科点专项科研基金优先发展领域课题资助(20112302130005)
作者简介: 何鹏(1972- ),男,博士,教授,博导,主要从事新材料连接及异种材料连接研究,联系地址:黑龙江省哈尔滨市南岗区西大直街92号哈尔滨工业大学先进焊接与连接国家重点实验室(150001),E-mail:hithepeng@hit.edu.cn
引用本文:   
何鹏, 王君, 顾小龙, 林铁松. 纳米填料导电胶研究进展[J]. 材料工程, 2013, 0(12): 1-7.
HE Peng, WANG Jun, GU Xiao-long, LIN Tie-song. Recent Progress of Electrically Conductive Adhesives with Nano-fillers. Journal of Materials Engineering, 2013, 0(12): 1-7.
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http://jme.biam.ac.cn/CN/10.3969/j.issn.1001-4381.2013.12.001      或      http://jme.biam.ac.cn/CN/Y2013/V0/I12/1
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