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材料工程  2013, Vol. 0 Issue (12): 74-79    DOI: 10.3969/j.issn.1001-4381.2013.12.014
  材料与工艺 本期目录 | 过刊浏览 | 高级检索 |
银含量对跌落条件下无铅焊点疲劳寿命和失效模式的影响
杨金丽1, 雷永平1,2, 林健1, 肖慧1
1. 北京工业大学 材料科学与工程学院, 北京 100124;
2. 哈尔滨工业大学 先进焊接与连接国家重点实验室, 哈尔滨 150001
Influence of Silver Content on Fatigue Life and Failure Mechanism of Lead-free Solder Joints Under Drop Conditions
YANG Jin-li1, LEI Yong-ping1,2, LIN Jian1, XIAO Hui1
1. College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China;
2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
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摘要 对3种不同Ag含量材料(Sn-3.0Ag-0.5Cu,Sn-1.0Ag-0.5Cu,Sn-0.3Ag-0.7Cu)的焊点进行跌落实验,实验中施加的加速度载荷为峰值3200g,脉冲持续时间1ms的半正弦波形加速度,利用电学测试、光学显微镜和扫描电子显微镜确定了失效的焊点并对失效焊点进行分析。结果表明:3种材料焊点的失效位置基本都在靠近印刷电路板(PCB)侧,BAG封装最外围4个拐角处的焊点最先失效。Sn-3.0Ag-0.5Cu,Sn-1.0Ag-0.5Cu焊点的失效模式均为脆性断裂,Sn-0.3Ag-0.7Cu为韧-脆混合断裂。且随着Ag含量的降低,金属间化合物(IMC)的厚度逐渐减小,焊点的寿命逐渐提高。
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关键词 银含量跌落冲击失效机理疲劳寿命    
Abstract:Drop tests were carried out with three kinds of materials (Sn-3.0Ag-0.5Cu,Sn-1.0Ag-0.5Cu and Sn-0.3Ag-0.7Cu),respectively. Half-sine acceleration loads was applied in the experiment, the peak value of half sine acceleration and pulse duration were 3200g and 1ms. The failure position of solder joint was identified and analyzed using electrical test, optical microscope, scanning electron microscope. The results show that most of the failures joints for the three kinds of materials locate at the printed circuit board (PCB) side. The solder joints at four outermost corners fail at first. And the failure modes of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu were all brittle fractures, while the Sn-0.3Ag-0.7Cu is brittle-ductile fracture. The thickness of intermetallic compound(IMC) gradually decreases and the life of solder joint enhances with the reduction of Ag content.
Key wordssilver content    drop impact    failure mechanism    fatigue life
收稿日期: 2012-09-05      出版日期: 2013-12-20
中图分类号:  TG115.28  
基金资助:北京市自然科学基金(3102002)和重点项目基金(KZ20110005002)资助;现代焊接生产技术国家重点实验室课题基金资助项目(51275006)
作者简介: 杨金丽(1988- ),女,硕士研究生,从事电子封装连接材料及其可靠性评价方面研究工作,联系地址:江苏省无锡市滨湖区山水东路188号江南计算技术研究所(214000),E-mail:fanyang131413@163.com
引用本文:   
杨金丽, 雷永平, 林健, 肖慧. 银含量对跌落条件下无铅焊点疲劳寿命和失效模式的影响[J]. 材料工程, 2013, 0(12): 74-79.
YANG Jin-li, LEI Yong-ping, LIN Jian, XIAO Hui. Influence of Silver Content on Fatigue Life and Failure Mechanism of Lead-free Solder Joints Under Drop Conditions. Journal of Materials Engineering, 2013, 0(12): 74-79.
链接本文:  
http://jme.biam.ac.cn/CN/10.3969/j.issn.1001-4381.2013.12.014      或      http://jme.biam.ac.cn/CN/Y2013/V0/I12/74
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