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材料工程  2014, Vol. 0 Issue (3): 55-59    DOI: 10.3969/j.issn.1001-4381.2014.03.010
  材料与工艺 本期目录 | 过刊浏览 | 高级检索 |
热循环对SnAgCu(纳米Al)/Cu焊点界面与性能影响
张亮1,2, 韩继光1, 何成文1, 郭永环1, 张剑1
1. 江苏师范大学 机电工程学院, 江苏 徐州 221116;
2. 江苏科技大学 先进焊接技术省级重点实验室, 江苏 镇江 212003
Effect of Thermal Cycles on the Interface and Property of SnAgCu(nano-Al)/Cu Solder Joints
ZHANG Liang1,2, HAN Ji-guang1, HE Cheng-wen1, GUO Yong-huan1, ZHANG Jian1
1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, Jiangsu, China;
2. Provincial Key Laboratory of Advanced Welding Technology, Jiangsu University of Science and Technology, Zhenjiang 212003, Jiangsu, China
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摘要 研究了纳米0.1%(质量分数)Al颗粒对SnAgCu无铅钎料与铜基板之间界面反应的影响,研究两种无铅钎料界面在-55~125℃热循环过程中的生长行为及其焊点力学性能变化。结果表明:随着热循环次数的增加,界面层金属间化合物的厚度明显增加,焊后界面层金属间化合物为Cu6Sn5相,在热循环过程中在Cu6Sn5和Cu基板之间出现Cu3Sn相。发现纳米Al颗粒的添加,界面层金属间化合物的厚度明显减少,纳米颗粒对界面层的生长具有明显的抑制作用。同时对焊点在热循环过程中的可靠性进行分析,发现焊点的拉伸力随着循环次数的增加逐渐降低,含纳米Al颗粒的焊点具有明显的优越性,在焊点服役期间,焊点失效路径为Cu6Sn5/Cu3Sn的界面处。
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张亮
韩继光
何成文
郭永环
张剑
关键词 无铅钎料界面反应金属间化合物失效路径    
Abstract:Effect of nano-Al particle on interface reaction between SnAgCu and Cu substrate was investigated, and interfacial layer growth of the two solders and mechanical properties of solder joints during -55-125℃ thermal cycles were systematically analyzed. The results indicate that the intermetallic compounds grow obviously with the development of thermal cycles, Cu6Sn5 IMCs are found at the as-soldered interface, and Cu3Sn IMCs appears between Cu6Sn5 and Cu substrate during thermal cycles. Moreover, it is found that the addition of nano-Al particles can reduce the thickness of intermetallic compounds layer, and nano-Al particles can retard the IMCs growth during thermal cycles. Finally, the reliability of solder joints during thermal cycles was studied, the tensile force decreases with the development of thermal cycles, and the SnAgCu solder joints bearing nano-particles exhibits improvements compared to SnAgCu. In service, the failure path of solder joints is observed between Cu6Sn5 and Cu3Sn phases.
Key wordslead-free solder    interface reaction    intermetallic compound    failure path
收稿日期: 2012-06-16     
1:  TG454  
基金资助:江苏省自然科学基金(BK2012144);江苏科技大学先进焊接技术省级重点实验室开放研究基金(JSAWS-11-03);江苏省高校自然科学基金(12KJB460005)
作者简介: 张亮(1984- ),男,副教授,博士,硕士生导师,主要从事钎焊材料、微电子封装材料与技术、焊点可靠性的研究,联系地址:江苏省徐州市铜山新区上海路101号江苏师范大学机电工程学院(221116),E-mail:zhangliang@jsnu.edu.cn
引用本文:   
张亮, 韩继光, 何成文, 郭永环, 张剑. 热循环对SnAgCu(纳米Al)/Cu焊点界面与性能影响[J]. 材料工程, 2014, 0(3): 55-59.
ZHANG Liang, HAN Ji-guang, HE Cheng-wen, GUO Yong-huan, ZHANG Jian. Effect of Thermal Cycles on the Interface and Property of SnAgCu(nano-Al)/Cu Solder Joints. Journal of Materials Engineering, 2014, 0(3): 55-59.
链接本文:  
http://jme.biam.ac.cn/jme/CN/10.3969/j.issn.1001-4381.2014.03.010      或      http://jme.biam.ac.cn/jme/CN/Y2014/V0/I3/55
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