Effect of Thermal Cycles on the Interface and Property of SnAgCu(nano-Al)/Cu Solder Joints
ZHANG Liang1,2, HAN Ji-guang1, HE Cheng-wen1, GUO Yong-huan1, ZHANG Jian1
1. School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, Jiangsu, China;
2. Provincial Key Laboratory of Advanced Welding Technology, Jiangsu University of Science and Technology, Zhenjiang 212003, Jiangsu, China
Abstract：Effect of nano-Al particle on interface reaction between SnAgCu and Cu substrate was investigated, and interfacial layer growth of the two solders and mechanical properties of solder joints during -55-125℃ thermal cycles were systematically analyzed. The results indicate that the intermetallic compounds grow obviously with the development of thermal cycles, Cu6Sn5 IMCs are found at the as-soldered interface, and Cu3Sn IMCs appears between Cu6Sn5 and Cu substrate during thermal cycles. Moreover, it is found that the addition of nano-Al particles can reduce the thickness of intermetallic compounds layer, and nano-Al particles can retard the IMCs growth during thermal cycles. Finally, the reliability of solder joints during thermal cycles was studied, the tensile force decreases with the development of thermal cycles, and the SnAgCu solder joints bearing nano-particles exhibits improvements compared to SnAgCu. In service, the failure path of solder joints is observed between Cu6Sn5 and Cu3Sn phases.
张亮, 韩继光, 何成文, 郭永环, 张剑. 热循环对SnAgCu(纳米Al)/Cu焊点界面与性能影响[J]. 材料工程, 2014, 0(3): 55-59.
ZHANG Liang, HAN Ji-guang, HE Cheng-wen, GUO Yong-huan, ZHANG Jian. Effect of Thermal Cycles on the Interface and Property of SnAgCu(nano-Al)/Cu Solder Joints. Journal of Materials Engineering, 2014, 0(3): 55-59.
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