热和化学亚胺化对ODPA/ODA聚酰亚胺薄膜性能的影响

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摘要以4,4′-二胺基二苯醚(ODA)和3,3′,4,4′-二苯醚四酸二酐(ODPA)为单体,采用两步法,分别经热亚胺化和化学亚胺化过程制备了两种聚酰亚胺(PI)薄膜,并对两种薄膜的性能进行了表征.傅立叶红外光谱(FT-IR)表明两种薄膜均已完全亚胺化.化学亚胺化的PI薄膜的玻璃化温度、热稳定性均高于热亚胺化的薄膜.拉伸性能测试表明热亚胺化的薄膜具有较高的断裂伸长率,而化学亚胺化的薄膜的拉伸强度、弹性模量较大.

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	程茹
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	黄培

关键词 ：聚酰亚胺薄膜, 化学亚胺化, 热亚胺化, 挠性印制电路板

Abstract：Two kinds of polyimide films were prepared based on the ODA and ODPA in NMP through two-step thermal or chemical imidization process and characterized by the cone and plate viscosimeter,GPC,FTIR,DSC,TGA and strain properties tests.The results showed that the films prepared from different imidizations had been totally transformed to polyimide films.The glass transition temperature,thermal decomposing temperature of the film from chemical imidization is higher than the one from thermal imidization.The strain tests showed that the film from thermal imidization had larger elongation at break,and the film from chemical imidization had larger tensile strength and elasticity modulus.

Key words： polyimide film chemical imidization thermal imidization FPC

收稿日期: 2006-08-14 出版日期: 2007-07-20

中图分类号:

TQ323.7

作者简介: 程茹(1979- ),女,博士,主要从事功能材料的合成及应用研究,联系地址:南京工业大学化学化工学院黄培新(210009).E-mail:phuang@njut.edu.cn

引用本文:

程茹, 朱梦冰, 黄培. 热和化学亚胺化对ODPA/ODA聚酰亚胺薄膜性能的影响[J]. 材料工程, 2007, 0(7): 51-54,58.
CHENG Ru, ZHU Meng-bing, HUANG Pei. Properties of Polyimide Films Based on ODPA and ODA by Thermal and Chemical Imidization. Journal of Materials Engineering, 2007, 0(7): 51-54,58.

链接本文:

http://jme.biam.ac.cn/CN/ 或 http://jme.biam.ac.cn/CN/Y2007/V0/I7/51

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