Study on Microstructure and Orientation Evolution of Ultra-fine Grained Copper Prepared by Asymmetrical Accumulative Rolling Bonding (AARB) During Annealing
WANG Jun-li, SHI Qing-nan, WANG Xiao-qi
Research Center for Analysis and Measurement, Kunming University of Science and Technology, Kunming, 650093, China
Abstract:The uniform ultra-fine grained copper was prepared by asymmetrical accumulative rolling bonding(AARB)and anneal.Microstructure and orientation evolution of samples after AARB and subsequent anneal were investigated.The deformed and annealed states were characterized by electron back scatter diffraction(EBSD)orientation image microscopy(OIM)and TEM.It was shown that there are many defects and substructure in the copper which is processed by AARB for six passes.The ultra-fine grained copper with the grain size of 200-500nm is obtained when deformed copper is annealed at 220℃ for 35-55min.Grains with all kinds of orientations exist together and some special orientations is not obvious.Elongation rate of UFG-Copper is increased.
王军丽, 史庆南, 王效琪. 异步累积叠轧技术制备超细晶铜材退火过程组织及取向研究[J]. 材料工程, 2008, 0(11): 5-8.
WANG Jun-li, SHI Qing-nan, WANG Xiao-qi. Study on Microstructure and Orientation Evolution of Ultra-fine Grained Copper Prepared by Asymmetrical Accumulative Rolling Bonding (AARB) During Annealing. Journal of Materials Engineering, 2008, 0(11): 5-8.
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