Effect of P on Microstructure and Mechanical Properties of Sn-Bi Solder
WANG Xiao-jing1, LIU Bin1, ZHOU Hui-ling2, WANG Jian-xin1, LIU Ning1, LI Tian-yang1
1. School of Material Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, Jiangsu, China;
2. Bantian Huawei Base, Huawei Technologies Co., Ltd., Shenzhen 518129, Guangdong, China
Abstract：Micro alloy metals P or P/Cu/Zn were added into Sn-Bi alloy to investigate the doping effects on microstructure, mechanical property, deformation fracture from the function of P in pure tin. The results show that doping 1%( mass fraction, same as below) P to pure tin can improve the strength and stiffness, decrease the plasticity. Only 0.1%P additive degenerates the mechanical property of Sn-Bi alloy, this is related to the existing form of element P in the base metal and the microstructure of the base metal. In Sn base alloy, P is distributed in phase or grain boundaries in the form of Sn-P intermetallic compounds (IMC), restricting the diffusion and shifting of deformation. Therefore, Sn-1P alloy, IMC distributed in beta-tin base plays a role of strengthening in pure tin doped situation, in Sn-Bi alloy instead, enhancing the deformation mismatch under loading becoming the weak spots where cracks may initiate and propagate, and leading to brittle fracture . Finally, addition of P/Zn/Cu simultaneously to Sn-Bi alloy, the doping can optimize the microstructure, improve the strength and enhance the ultimate tensile strength (UTS) of Sn-Bi alloys.
王小京, 刘彬, 周慧玲, 王俭辛, 刘宁, 李天阳. P对Sn-Bi合金组织与性能的影响[J]. 材料工程, 2016, 44(7): 113-118.
WANG Xiao-jing, LIU Bin, ZHOU Hui-ling, WANG Jian-xin, LIU Ning, LI Tian-yang. Effect of P on Microstructure and Mechanical Properties of Sn-Bi Solder. Journal of Materials Engineering, 2016, 44(7): 113-118.
[1] TONG X C. Thermal Interface Materials in Electronic Packaging,in Advanced Materials for Thermal Management of Electronic Packaging[M]. London:Springer,2011.305-371.
[2] ZHANG L,XUE S B,GAO L L,et al. Development of Sn-Zn lead-free solders bearing alloying elements[J]. Journal of Materials Science:Materials in Electronics,2010,21(1):1-15.
[3] LIU C Z,KANG T Y,WEI W,et al. Effect of high intensity magnetic field on intermetallic compounds growth in SnBi/Cu microelectronic interconnect[J]. Journal of Alloys and Compounds,2011,509(33):8475-8477.
[4] CHEN S,ZHANG L,LIU J,et al. A reliability study of nanoparticles reinforced composite lead-free solder[J]. Mater Trans,2010,51(10):1720-1726.
[5] ZHU Q S,SONG H Y,LIU H Y,et al. Effect of Zn addition on microstructure of Sn-Bi joint[C]//Beijing:Proceedings of the 9th ICEPT-HDP,2009:1043-1046.
[6] DUTCHAK Y I,QSIPENKO V P,PANASYUK P V. Thermal conductivity of Sn-Bi alloys in the solid and liquid states[J]. Soviet Physics Journal,1968,11(10):145-147.
[7] ZANG L,YUAN Z,ZHU Y,et al. Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K[J]. Colloids and Surfaces A:Physicochemical and Engineering Aspects,2012,414(11):57-65.
[8] 何鹏,吕晓春,张斌斌,等. 合金元素对Sn-57Bi无铅钎料组织及韧性的影响[J]. 材料工程,2010,(10):13-17,31 HE P,LU X C,ZHANG B B,et al.Effect of alloy element on microstructure and impact toughness of Sn-57Bi lead-free solders[J].Journal of Materials Engineering,2010,(10):13-17,31.
[9] WANG X J,ZHU Q S,LIU B,et al. Effect of doping Al on the liquid oxidation of Sn-Bi-Zn solder[J]. J Mater Sci:Mater Electron,2014,25(5):2297-2304.
[10] XIAN A P,GONG G L. Surface oxidation of molten Sn-0.07 wt.% P in air at 280℃[J]. Journal of Materials Research,2008,23(6):1532-1536.
[11] FU X,ZHOU J,SUN Y,et al. Effect of phosphorus on microstructure and properties of Sn-8Zn-3Bi lead-free solder[J]. Journal of Southeast University(Natural Science Edition),2006,36(5):832-835.
[12] GLAZER J. Metallurgy of low temperature of Pb-free solders for electronic assemble[J]. International Materials Reviews,1995,40(2):65-93.
[13] KILINSKI T J,LESNIAK J R,SANDOR B I. Solder Joint Reliability:Theory and Application[M]. New York:Springer,1991.384-405.
[14] LAI Y S,YANG P F,YAH C L. Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition[J]. Microelectronics Reliability,2006,46(2-4):645-650.
[15] SUH D,KIM D W,LIU P,et al. Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high-strain rate conditions[J]. Materials Science and Engineering:A,2007,460-461(15):595-603.
[16] KIM H,ZHANG M,KUMAR C M,et al. Improved drop reliability performance with lead free solders of low Ag content and their failure modes[C]//Reno NV:57th Electronic Components and Technology Conference,2007:962-967.
[17] ABTEW M,SELVADURAY G. Lead-free solders in microelectronics[J]. Materials Science & Engineering:Reports,2000,27(5-6):95-141.
[18] GLAZER J. Metallurgy of low temperature of Pb-free solders for electronic assemble[J]. International Materials Reviews,1995,40(2):65-93.
[19] WANG F,GAO F,QIAN Y. Depressing effect of 0.2 wt.% Zn addition into Sn-3.0Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging[J]. J Electron Mater,2006,35(10):1818-1824.
[20] WANG X J, WANG Y L,WANG F J, et al. Effects of Zn, Zn-Al and Zn-P additions on the tensile properties of Sn-Bi solder[J]. Acta Metallurgica Sinica (English Letters), 2014, 27(6):1159-1164.
[21] LI G,SHI Y,HAO H,et al. Effect of phosphorus element on the comprehensive properties of Sn-Cu lead-free solder[J]. J Alloys Compd,2010,491(1-2):382-385.
2016, Vol. 44 
