Ti/Nb作中间层脉冲加压扩散连接TiC金属陶瓷与不锈钢

doi:10.11868/j.issn.1001-4381.2015.000177

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摘要

用Ti/Nb作中间层，在温度890℃、时间4~12min、脉冲压力2~10MPa、频率f=0.5Hz、恒压10MPa下，对TiC金属陶瓷和304不锈钢（304SS）进行脉冲加压与恒压扩散焊，获得了牢固的固相扩散焊接头。通过扫描电镜SEM、能谱EDS、X射线衍射XRD与剪切性能测试，对接头的显微组织、界面产物与强度进行分析。结果显示：两种接头的界面物相相似，主要有σ相，（β-Ti，Nb）与α+β-Ti固溶体。连接时间10min时，恒压下的TiC/304SS接头抗剪强度为55.6MPa，而脉冲加压下的接头抗剪强度达110MPa。恒压下接头断裂方式为TiC陶瓷断裂，而脉冲压力下接头断裂方式为TiC陶瓷与界面产物间交替进行的混合断裂。

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	李佳
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	黄利

关键词 ： TiC金属陶瓷, 扩散焊, 脉冲压力, Ti/Nb, 微观组织

Abstract：

Impulse pressuring diffusion bonding (IPDB) and constant pressuring diffusion bonding (CPDB) of TiC cermet to 304 stainless steel (304SS) using Ti/Nb interlayer was carried out at 890℃ under a impulse pressuring of 2-10MPa and a constant pressuring of 10MPa within a duration of only 4-12min, and a robust metallurgical bonding was achieved. Microstructure characterization and shear performance of the IPDB and CPDB joints were analyzed by SEM, EDS, XRD and shearing test. The results show that the interface phases in those two kinds of joints are similar, which are mainly σ phase, (β-Ti, Nb) and α+β-Ti solid solution. When the joint is bonded for 10min, shear strength of TiC/304SS CPDB joints is 55.6MPa, while the shear strength of IPDB joints reaches 110MPa. The fracture of CPDB joints is TiC cermet fracture, while that of IPDB joints is mixed fracture by alternated between TiC cermet and reaction layer.

Key words： TiC cermet diffusion bonding impulse pressuring Ti/Nb microstructure

收稿日期: 2015-02-02 出版日期: 2017-03-22

中图分类号:

TG457

基金资助:国家自然科学基金资助项目(51205428)

通讯作者: 盛光敏 E-mail: gmsheng@cqu.edu.cn

作者简介: 盛光敏 (1958-), 男, 教授, 博士, 主要从事异种材料的连接、高抗震性能建筑结构钢的研究, 联系地址:重庆市沙坪坝区沙正街174号重庆大学材料科学与工程学院 (400044), E-mail:gmsheng@cqu.edu.cn

引用本文:

李佳, 盛光敏, 黄利. Ti/Nb作中间层脉冲加压扩散连接TiC金属陶瓷与不锈钢[J]. 材料工程, 2017, 45(3): 54-59.
Jia LI, Guang-min SHENG, Li HUANG. Impulse Pressuring Diffusion Bonding of TiC Cermet to Stainless Steel Using Ti/Nb Interlayer. Journal of Materials Engineering, 2017, 45(3): 54-59.

链接本文:

http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2015.000177 或 http://jme.biam.ac.cn/CN/Y2017/V45/I3/54

Table 1 基体的化学成分 (质量分数/%)

Table 2 Ti，Nb及基体的室温热物理性能

Fig.1 扩散焊工艺示意图 (a) 脉冲加压扩散焊；(b) 恒压扩散焊

Fig.2 扩散焊接头示意图 (a) 试样装配方式; (b) 接头剪切测试方式

Fig.3 扩散焊接头的抗剪强度随焊接时间的变化

Fig.4 扩散焊接接头的SEM形貌 (1) 和元素浓度分布曲线 (2) (a) 脉冲加压扩散焊；(b) 恒压扩散焊

Table 3 脉冲加压扩散焊接头EDS分析 (原子分数/%)

Table 4 扩散焊接头中各反应层的厚度

Fig.5 载荷与断裂位移的关系

Fig.6 扩散焊接头断口SEM形貌 (a), (b) 脉冲加压扩散焊；(c), (d) 恒压扩散焊

Fig.7 接头断面XRD分析 (a) 脉冲加压扩散焊；(b) 恒压扩散焊

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