Fe/Al异质金属接头界面组织演变、生长动力学及力学性能

doi:10.11868/j.issn.1001-4381.2021.000694

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摘要

采用真空扩散连接方法研究Fe/Al异质金属接头界面组织演变规律、金属间化合物(intermetallic compound，IMC)生长动力学及力学性能。结果表明：焊接温度为550 ℃时，接头界面无IMC生成，当焊接温度超过575 ℃时，界面由Fe₂Al₅及少量FeAl₃ IMC构成，且随焊接温度升高IMC层迅速长大。在120 min保温时间条件下，接头剪切强度随焊接温度的升高先增加后降低，当焊接温度为575 ℃时，接头剪切强度达到最大值37 MPa。在550~625 ℃范围内，基于热力学分析得出Fe₂Al₅的吉布斯自由能ΔG_Fe-Al最低，而FeAl₃的ΔG_Fe-Al次之，在接头界面处IMC生成顺序为Fe₂Al₅→FeAl₃。Fe/Al接头界面IMC的生长随焊接温度呈抛物线规律，其生长激活能为282.6 kJ·mol^-1。在575，600，625 ℃条件下，界面IMC的生长速率分别为1.13×10^-14，3.59×10^-14，1.21×10^-13 m²·s^-1。

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	李鹏
	邹存柱
	董红刚
	吴宝生
	李超
	杨跃森
	闫德俊

关键词 ： Fe/Al异质金属, 扩散连接, 金属间化合物, 生长动力学

Abstract：

The interfacial microstructure evolution, growth kinetics of the intermetallic compound (IMC) and mechanical properties of Fe/Al dissimilar metal joints were investigated by vacuum diffusion bonding. The results show that there is no IMC formed on the interface of the joint bonded at temperature of 550 ℃. When the bonding temperature exceeds 575 ℃, the interfacial region is composed of Fe₂Al₅ and a small amount of FeAl₃, and the thickness of IMC layer increases rapidly with the increase of bonding temperature.Under the bonding time of 120 min, the shear strength of the joint increases first and then decreases with the increase of the bonding temperature, and the shear strength of the joint reaches the maximum value of 37 MPa.According to thermodynamic theory, the Gibbs free energy change of Fe₂Al₅ is the lowest in the range from 550 ℃ to 625 ℃, and then followed by that of FeAl₃, and the generated sequence of interfacial IMC can be: Fe₂Al₅→FeAl₃. The interfacial IMC grow in a parabolic manner as a function of bonding temperature, and its growth activation energy is 282.6 kJ·mol^-1.The growth rates of IMC at the interface are 1.13× 10^-14, 3.59×10^-14, 1.21×10^-13 m²·s^-1 at 575, 600, 625 ℃ respectively.

Key words： Fe/Al dissimilar metal diffusion bonding intermetallic compound growth kinetics

收稿日期: 2021-07-25 出版日期: 2022-05-23

中图分类号:

TG401

基金资助:国家自然科学基金项目(52075074);中央高校基本科研业务费(DUT21 JC16);广东特支计划(2019TQ05C752)

通讯作者: 董红刚 E-mail: donghg@dlut.edu.cn

作者简介: 董红刚(1975—)，男，教授，博士，主要从事异种材料连接工艺与冶金机理、焊接材料成分设计、焊接热过程数值计算的研究，联系地址：辽宁省大连市甘井子区凌工路2号大连理工大学铸造中心304室(116024)，E-mail：donghg@dlut.edu.cn

引用本文:

李鹏, 邹存柱, 董红刚, 吴宝生, 李超, 杨跃森, 闫德俊. Fe/Al异质金属接头界面组织演变、生长动力学及力学性能[J]. 材料工程, 2022, 50(5): 43-51.
Peng LI, Cunzhu ZOU, Honggang DONG, Baosheng WU, Chao LI, Yuesen YANG, Dejun YAN. Interfacial microstructure evolution, growth kinetics and mechanical properties of Fe/Al dissimilar metal joints. Journal of Materials Engineering, 2022, 50(5): 43-51.

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http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.000694 或 http://jme.biam.ac.cn/CN/Y2022/V50/I5/43

Table 1 1060纯铝和工业纯铁的化学成分(质量分数/%)

Fig.1 Fe/Al异质金属焊接试样尺寸示意图(a)和接头宏观形貌(b)

Table 2 扩散连接工艺参数

Fig.2 扩散连接工艺参数曲线

Fig.3 剪切实验试样尺寸(a)和示意图(b)

Fig.4 不同焊接温度下Fe/Al接头界面微观组织
(a)550 ℃; (b)575 ℃; (c)600 ℃; (d)625 ℃

Fig.5 不同焊接温度下Fe/Al接头界面微观组织(1)及线扫描分析结果(2)
(a)550 ℃; (b)575 ℃; (c)600 ℃; (d)625 ℃

Table 3 图 5位置A~I的化学成分(原子分数/%)

Fig.6 焊接温度575 ℃下接头断口表面XRD谱图
(a)Fe侧; (b)Al侧

Fig.7 不同焊接温度下Fe/Al接头剪切强度

Table 4 Fe-Al体系中发生的化学反应以及IMC的标准生成焓和标准熵值

Table 5 Fe-Al金属间化合物ΔG_Fe-Al与焊接温度的关系

Fig.8 IMC吉布斯自由能变与焊接温度的关系

Table 6 不同工艺条件下IMC的平均厚度

Fig.9 界面反应层的生长曲线(a)和生长激活能(b)

Fig.10 接头界面IMC生长示意图
(a)原子扩散; (b)Fe₂Al₅形成阶段; (c)FeAl₃形核阶段; (d)IMC连续生长

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