热和化学亚胺化对ODPA/ODA聚酰亚胺薄膜性能的影响

程茹, 朱梦冰, 黄培

材料工程 ›› 2007, Vol. 0 ›› Issue (7) : 51-54,58.

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材料工程 ›› 2007, Vol. 0 ›› Issue (7) : 51-54,58.
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热和化学亚胺化对ODPA/ODA聚酰亚胺薄膜性能的影响

  • 程茹, 朱梦冰, 黄培
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Properties of Polyimide Films Based on ODPA and ODA by Thermal and Chemical Imidization

  • CHENG Ru, ZHU Meng-bing, HUANG Pei
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文章历史 +

摘要

以4,4′-二胺基二苯醚(ODA)和3,3′,4,4′-二苯醚四酸二酐(ODPA)为单体,采用两步法,分别经热亚胺化和化学亚胺化过程制备了两种聚酰亚胺(PI)薄膜,并对两种薄膜的性能进行了表征.傅立叶红外光谱(FT-IR)表明两种薄膜均已完全亚胺化.化学亚胺化的PI薄膜的玻璃化温度、热稳定性均高于热亚胺化的薄膜.拉伸性能测试表明热亚胺化的薄膜具有较高的断裂伸长率,而化学亚胺化的薄膜的拉伸强度、弹性模量较大.

Abstract

Two kinds of polyimide films were prepared based on the ODA and ODPA in NMP through two-step thermal or chemical imidization process and characterized by the cone and plate viscosimeter,GPC,FTIR,DSC,TGA and strain properties tests.The results showed that the films prepared from different imidizations had been totally transformed to polyimide films.The glass transition temperature,thermal decomposing temperature of the film from chemical imidization is higher than the one from thermal imidization.The strain tests showed that the film from thermal imidization had larger elongation at break,and the film from chemical imidization had larger tensile strength and elasticity modulus.

关键词

聚酰亚胺薄膜 / 化学亚胺化 / 热亚胺化 / 挠性印制电路板

Key words

polyimide film / chemical imidization / thermal imidization / FPC

引用本文

导出引用
程茹, 朱梦冰, 黄培. 热和化学亚胺化对ODPA/ODA聚酰亚胺薄膜性能的影响[J]. 材料工程, 2007, 0(7): 51-54,58
CHENG Ru, ZHU Meng-bing, HUANG Pei. Properties of Polyimide Films Based on ODPA and ODA by Thermal and Chemical Imidization[J]. Journal of Materials Engineering, 2007, 0(7): 51-54,58
中图分类号: TQ323.7   

参考文献

[1] 刘习奎,顾宜.用于挠性电路基板的低热膨胀系数聚酰亚胺研究进展[J].材料导报,2001,15(12):46-48.
[2] 张雯,张露,李家利,等.国外聚酰亚胺薄膜概况及其应用进展[J].绝缘材料,2001,(2):21-23.
[3] 丁孟贤,何天白.聚酰亚胺新型材料[M].北京:科学出版社,1998.
[4] MOHAMMED H K,CHONG S P S.Chemical imidization study by spectroscopic techniques.Ⅰ model amic acids[J].Macromolecules,1998,31:5771-5778.
[5] MOHAMMED H K,CHONG S P S.Chemical imidization study by spectroscopic techniques.Ⅱ polyamic acids[J].Macromolecules,1998,31:5779-5784.
[6] MOHAMMED H K,CHONG S P S,SAMUEL J H.Syntheses and characterization of model Imide compounds and chemical imidization study[J].Macromolecules,1992,25:3751-3757.
[7] PRYDE C A.IR Studies of Polyimides.I effects of chemical and physical changes during cure[J].J Polym Sci,Part A:Polym Chem,1989,27:711-754.
[8] KEREUZ J A,ENDREY A L.Studies of thermal cyclizations of polyamic acids and tertiary amine salts[J].J Polym Sci,Part A,1966,4:2607-2616.
[9] SNYDER R W.FTIR studies of polyimides:thermal curing[J].Macromolecules,1989,22:4166-4172.
[10] 黄培,耿洪斌,程茹,等.长链聚酰胺酸的热环化动力学[J].高分子学报,2004,2:256-262.
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