Effect of Adding Ultrasonic on Copper Electroless Plating of Polyurethane Foam
ZHAO Peng1, PU Yu-ping1, HUANG Chun-hui2, LU Guang-shu2
Author information+
1. Powder Metallurgy Department, China Iron & Steel Research Institute Group, Beijing 100081, China; 2. School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China
To research the influence of adding ultrasonic on the process that electroless plating copper film on the framework of polyurethane foam,the paper respectively investigated the effect of adding ultrasonic on the Sn-Pd activated polyurethane foam directly and on the copper film covered framework.The result shows that adding ultrasonic on the copper film covered framework can shorten the inducing time and elevate the speed of the reaction,and the lifting rate of weight increasing slows down while the ultrasonic power augments.When adding ultrasonic on the Sn-Pd activated polyurethane foam,which had not been covered with continuous copper film,the palladium nuclei could be shocked away from the framework,so the ultrasonic should be added after 5 minutes' pre-plating at least.
ZHAO Peng, PU Yu-ping, HUANG Chun-hui, LU Guang-shu.
Effect of Adding Ultrasonic on Copper Electroless Plating of Polyurethane Foam[J]. Journal of Materials Engineering, 2008, 0(4): 43-46
[1] ASHBY M F,EVANS A G,FLECK N A,et al.Metal foams:a design guide[M].Oxford;Butterworth-Heinermann,2000. [2] 罗远辉.泡沫铜制备工艺研究[J].有色金属,2002,11(4):17-20. [3] 荆慧,吕广庶.聚氨酯泡沫化学镀的前处理工艺的改进[J].电镀与涂饰,2005,11:12-14. [4] BANHART J.Manufacture,characterisation and application of cellular metals and metal foams[J].Progress in Materials Science,2001,46(2):559-632.