耐高温瞬时液相连接无铅钎焊接头的时效稳定性
李正兵, 王德, 胡德安, 陈益平, 程东海, 郭义乐, 何凯, 黄硕, 李晓军
High temperature resistant aging stability of lead-free solder joints by TLP bonding
Zheng-bing LI, De WANG, De-an HU, Yi-ping CHEN, Dong-hai CHENG, Yi-le GUO, Kai HE, Shuo HUANG, Xiao-jun LI
材料工程
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2021, (10): 82
-88
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DOI: 10.11868/j.issn.1001-4381.2020.000853
