Cu/难熔金属体系不互溶纳米多层膜的研究现状与展望：从微观界面设计到宏观连接制造
李红, 金天, 潘瑞, 熊华平, 王义朋, HODÚLOVÁ Erika
Research status and prospects of immiscible nano-multilayer films in Cu/refractory metal systems： from microscopic interface design to macroscopic joining manufacturing
LI Hong, JIN Tian, PAN Rui, XIONG Huaping, WANG Yipeng, HODÚLOVÁ Erika
材料工程
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2026, (8): 53
-68
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DOI: 10.11868/j.issn.1001-4381.2026.000268
