添加剂和电流密度对镍钴合金电铸层组织结构的影响
裴和中, 黄攀, 史庆南, 陆峰, 张俊, 张国亮
Influences of Additive and Current Density on the Microstructure of the Electroforming Ni-Co Alloy
PEI He-zhong, HUANG Pan, SHI Qing-nan, LU Feng, ZHANG Jun, ZHANG Guo-liang
材料工程
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2013, (6): 18
-24
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DOI: 10.3969/j.issn.1001-4381.2013.06.004
