电子组装用SnAgCu系无铅钎料的研究进展
陈建勋, 赵兴科, 刘大勇, 黄继华, 邹旭晨
Research Development of SnAgCu System Lead-free Solders in Electronics Packing
CHEN Jian-xun, ZHAO Xing-ke, LIU Da-yong, HUANG Ji-hua, ZOU Xu-chen
材料工程
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2013, (9): 91
-98
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DOI: 10.3969/j.issn.1001-4381.2013.09.018
