Al-Si电子封装材料粉末冶金法致密性研究
禹胜林, 薛松柏, 尹邦跃, 黄薇
Sintering Densification of Al-Si Composite by Powder Metallurgy Method for Electronic Packaging
YU Sheng-lin, XUE Song-bai, YIN Bang-yue, HUANG Wei
材料工程
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2014, (2): 45
-50
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DOI: 10.3969/j.issn.1001-4381.2014.02.009
