回流冷却与等温时效过程中Sn-35Bi-1Ag/Ni-P/Cu焊点组织演变
卢汉桥, 李玉龙, 余啸, 龙维峰, 江建锋
Microstructure Evolution of Sn-35Bi-1Ag/Ni-P/Cu Solder Joints During Post-reflow Cooling and Isothermal Aging
Han-qiao LU, Yu-long LI, Xiao YU, Wei-feng LONG, Jian-feng JIANG
材料工程
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2018, (6): 95
-100
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DOI: 10.11868/j.issn.1001-4381.2017.000412
