微电子封装中全Cu3Sn焊点形成过程中的组织演变及生长形貌
梁晓波, 李晓延, 姚鹏, 李扬, 金凤阳
Microstructural Evolution and Growth Morphology During Formation Process of Full Cu3Sn Solder Joint in Microelectronic Packaging
Xiao-bo LIANG, Xiao-yan LI, Peng YAO, Yang LI, Feng-yang JIN
材料工程
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2018, (8): 106
-112
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DOI: 10.11868/j.issn.1001-4381.2017.000141
