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Microstructure and mechanical property of full Cu3Sn solder joints during high-temperature aging
Yangyang ZHU, Xiaoyan LI, Weidong ZHANG, Hu ZHANG, Xi HE
Journal of Materials Engineering . 2022, (9): 169 -176 .  DOI: 10.11868/j.issn.1001-4381.2021.000977