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Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper
Chao CUI, Lili YUAN, Liang YIN, Yudong HUANG, Linghui MENG, Nianqun YANG, Shiyong YANG
Journal of Materials Engineering . 2022, (10): 128 -138 .  DOI: 10.11868/j.issn.1001-4381.2021.001095