• Ei，ESCI收录期刊
  • 中国科学引文数据库(CSCD)核心期刊
  • 中文核心期刊
  • 文摘与引文数据库(Scopus)
  • 剑桥科学文摘(CSA)
Effect of Thermal Cycles on the Interface and Property of SnAgCu(nano-Al)/Cu Solder Joints
ZHANG Liang, HAN Ji-guang, HE Cheng-wen, GUO Yong-huan, ZHANG Jian
Journal of Materials Engineering . 2014, (3): 55 -59 .  DOI: 10.3969/j.issn.1001-4381.2014.03.010