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Microstructure Evolution of Sn-35Bi-1Ag/Ni-P/Cu Solder Joints During Post-reflow Cooling and Isothermal Aging
Han-qiao LU, Yu-long LI, Xiao YU, Wei-feng LONG, Jian-feng JIANG
Journal of Materials Engineering . 2018, (6): 95 -100 .  DOI: 10.11868/j.issn.1001-4381.2017.000412