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Microstructural Evolution and Growth Morphology During Formation Process of Full Cu3Sn Solder Joint in Microelectronic Packaging
Xiao-bo LIANG, Xiao-yan LI, Peng YAO, Yang LI, Feng-yang JIN
Journal of Materials Engineering . 2018, (8): 106 -112 .  DOI: 10.11868/j.issn.1001-4381.2017.000141