Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal
SHI Lei1,2, CUI Liang1, ZHOU Fei1, GU Xiao-long1, HE Peng2
1. Zhejiang Provincial Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310007, China;
2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
Abstract:Influence of Sn on microstructure, melting characteristic and brazing performance of electric vacuum Ag-Cu filler metal was studied by using scanning electronic microscope (SEM) with energy disperse spectroscopy (EDS), differential scanning calorimetry (DSC) and contrast tests. The results show that, while the addition of Sn is 4% (mass fraction,the same below), there is no brittle β-Cu phase in Ag60Cu filler metal,the effect on the processing performance is not obvious; with the increase of Sn content, the liquidus temperature of Ag60Cu filler metal decreases gradually, but the solidus temperature drops drastically,resulting in wider melting temperature range, and worse gap filling ability of filler metal. The Ag60Cu filler metal with Sn content of 4% has good spreading and metallurgical bonding abilities on copper plates, which are closer to that of BAg72Cu filler metal, and it can be processed into flake filler metal to replace the BAg72Cu flake filler metal to be used.
石磊, 崔良, 周飞, 顾小龙, 何鹏. Sn对电真空Ag-Cu钎料组织和性能的影响[J]. 材料工程, 2016, 44(10): 54-59.
SHI Lei, CUI Liang, ZHOU Fei, GU Xiao-long, HE Peng. Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal. Journal of Materials Engineering, 2016, 44(10): 54-59.
[1] 张启运, 庄鸿寿. 钎焊手册[M].2版. 北京:机械工业出版社, 2008. 410-426. ZHANG Q Y, ZHUANG H S. Brazing and soldering manual[M]. 2nd ed. Beijing:China Machine Press, 2008. 410-426.
[2] 薛松柏, 钱乙余, 胡晓萍. 元素锡、铟在银基钎料中的作用及其机理[J]. 焊接, 1998, (11):28-31. XUE S B, QIAN Y Y, HU X P. Effect of tin and indium in silver filler metal and its mechanism[J]. Welding & Joining, 1998, (11):28-31.
[3] 王世伟. 合金元素对铜基低银钎料性能的影响[J]. 中国有色金属学报, 1995, 5(2):108-111. WANG S W. Effect of alloy elements on performances of copper-based low-silver filler metals[J]. Transactions of Nonferrous Metals Society of China, 1995, 5(2):108-111.
[4] HE Z Y, DING L P. Investigation on Ag-Cu-Sn brazing filler metals[J]. Materials Chemistry and Physics, 1997, 49:1-6.
[5] 赵文杰, 王俊勃, 王瑞娟, 等. 掺杂对Cu/SnO2电触头材料的性能影响[J]. 航空材料学报, 2015, 35(6):60-64. ZHAO W J, WANG J B, WANG R J, et al. Influence of doping on properties of Cu/SnO2 contact materials[J]. Journal of Aeronautical Materials, 2015, 35(6):60-64.
[6] SISAMOUTH L, HAMDI M, ARIGA T. Investigation of gap filling ability of Ag-Cu-In brazing filler metals[J]. Journal of Alloys and Compounds, 2010, 504:325-329.
[7] 卢方焱, 薛松柏, 张亮, 等. 微量In对AgCuZn钎料组织和性能的影响[J]. 焊接学报, 2008, 29(12):85-88. LU F Y, XUE S B, ZHANG L, et al. Effects of trace indium on properties and microstructure of Ag-Cu-Zn filler metal[J]. Transactions of the China Welding Institution, 2008, 29(12):85-88.
[8] 韩宪鹏, 薛松柏, 顾立勇, 等. 镓对Ag-Cu-Zn钎料组织和力学性能的影响[J]. 焊接学报, 2008, 29(2):45-48. HAN X P, XUE S B, GU L Y, et al. Effect of gallium on microstructure and mechanical properties of Ag-Cu-Zn filler metals[J]. Transactions of the China Welding Institution, 2008, 29(2):45-48.
[9] 卢方焱, 薛松柏, 赖忠民, 等. 镓对AgCuZn钎料组织和性能的影响[J]. 焊接学报, 2009, 30(1):55-59. LU F Y, XUE S B, LAI Z M, et al. Effect of gallium on microstructure and properties of Ag-Cu-Zn filler metal[J]. Transactions of the China Welding Institution, 2009, 30(1):55-59.
[10] 李卓然, 刘彬, 冯吉才. 镍对Ag20CuZnSnP钎料铺展润湿性和接头抗剪强度的影响[J]. 焊接学报, 2008, 29(9):19-22. LI Z R, LIU B, FENG J C. Effect of Ni on wettability and shear strength of joints of Ag20CuZnSnP filler metal[J]. Transactions of the China Welding Institution, 2008, 29(9):19-22.
[11] YEN Y W, LEE C Y, HUANG D P, et al. Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system[J]. Journal of Alloys and Compounds, 2008, 466(1-2):383-386.
[12] YEN Y W, LEE C Y, HUANG D P, et al. Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system[J]. Fuel Cells Bulletin, 2008, 2008(2008):12-15.
[13] NING H L, GENG Z T, MA J S, et al. Joining of sapphire and hot pressed Al2O3 using Ag70.5Cu27.5Ti2 brazing filler metal[J]. Ceramics International, 2003, 29:689-694.
[14] LIU G W, QIAO G J, WANG H J, et al. Pressureless brazing of zirconia to stainless steel with Ag-Cu filler metal and TiH2 powder[J]. Journal of the European Ceramic Society, 2008, 28:2701-2708.
[15] YANG Z W, HE P, ZHANG L X, et al. Microstructural evolution and mechanical properties of the joint of TiAl alloys and C/SiC composites vacuum brazed with Ag-Cu filler metal[J]. Materials Characterization, 2011, 62:825-832.
[16] 吴世彪, 熊华平, 陈波, 等. 采用Ag-Cu-Ti钎料真空钎焊SiO2f/SiO2复合陶瓷与C/C复合材料[J]. 材料工程, 2014, (10):16-20. WU S B, XIONG H P, CHEN B, et al. Vacuum brazing of SiO2f/SiO2 and C/C composite using Ag-Cu-Ti filler alloy[J]. Journal of Materials Engineering, 2014, (10):16-20.
[17] 薛松柏, 钱乙余, 赵振清, 等. 银基钎料中铈与杂质元素铅、铋作用机制[J]. 中国稀土学报, 2002, 20(5):436-439. XUE S B, QIAN Y Y, ZHAO Z Q, et al. Mechanism of interaction relation between rare earth element cerium and impurity elements lead and bismuth in Ag-based filler metal[J]. Journal of the Chinese Rare Earth Society, 2002, 20(5):436-439.
[18] 薛松柏, 钱乙余, 胡晓萍. 杂质元素铅、铋在银基钎料中的有害作用[J]. 焊接, 1998, (12):6-9. XUE S B, QIAN Y Y, HU X P. Harmful effect of impurities-Pb & Bi in silver filler metal[J]. Welding & Joining, 1998, (12):6-9.
[19] 张冠星, 龙伟民. 微量元素Ce、Sb、Li对银基钎料润湿和抗氧化性能的影响[J]. 热加工工艺, 2011, 40(13):4-6. ZHANG G X, LONG W M. Effect of trace element Ce, Sb and Li on wettability and oxidation resistance of silver-based brazing filler metal[J]. Hot Working Technology, 2011, 40(13):4-6.
[20] 王仕勤, 朱平. Cu基电真空低银钎料的力学性能[J]. 焊接技术, 1996, (3):31-32. WANG S Q, ZHU P. Mechanical properties of copper-based low-silver electric vacuum filler metals[J]. Welding Technology, 1996, (3):31-32.