Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal
SHI Lei1,2, CUI Liang1, ZHOU Fei1, GU Xiao-long1, HE Peng2
1. Zhejiang Provincial Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310007, China;
2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
Abstract：Influence of Sn on microstructure, melting characteristic and brazing performance of electric vacuum Ag-Cu filler metal was studied by using scanning electronic microscope (SEM) with energy disperse spectroscopy (EDS), differential scanning calorimetry (DSC) and contrast tests. The results show that, while the addition of Sn is 4% (mass fraction,the same below), there is no brittle β-Cu phase in Ag60Cu filler metal,the effect on the processing performance is not obvious; with the increase of Sn content, the liquidus temperature of Ag60Cu filler metal decreases gradually, but the solidus temperature drops drastically,resulting in wider melting temperature range, and worse gap filling ability of filler metal. The Ag60Cu filler metal with Sn content of 4% has good spreading and metallurgical bonding abilities on copper plates, which are closer to that of BAg72Cu filler metal, and it can be processed into flake filler metal to replace the BAg72Cu flake filler metal to be used.
石磊, 崔良, 周飞, 顾小龙, 何鹏. Sn对电真空Ag-Cu钎料组织和性能的影响[J]. 材料工程, 2016, 44(10): 54-59.
SHI Lei, CUI Liang, ZHOU Fei, GU Xiao-long, HE Peng. Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal. Journal of Materials Engineering, 2016, 44(10): 54-59.
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2016, Vol. 44 
