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材料工程  2016, Vol. 44 Issue (10): 54-59    DOI: 10.11868/j.issn.1001-4381.2016.10.008
  材料与工艺 本期目录 | 过刊浏览 | 高级检索 |
Sn对电真空Ag-Cu钎料组织和性能的影响
石磊1,2, 崔良1, 周飞1, 顾小龙1, 何鹏2
1. 浙江省冶金研究院有限公司 浙江省钎焊材料与技术重点实验室, 杭州 310007;
2. 哈尔滨工业大学 先进焊接与连接国家重点实验室, 哈尔滨 150001
Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal
SHI Lei1,2, CUI Liang1, ZHOU Fei1, GU Xiao-long1, HE Peng2
1. Zhejiang Provincial Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co., Ltd., Hangzhou 310007, China;
2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
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摘要 利用扫描电镜及其能谱仪、同步热分析仪以及对比实验来分析Sn对电真空Ag-Cu钎料微观组织、熔化特性和钎焊性能的影响。结果表明:Sn添加4%(质量分数,下同)时,Ag60Cu钎料中没有脆性β-Cu相生成,对钎料的加工性能影响不大;随着Sn含量的增加,Ag60Cu钎料的液相线温度逐渐降低,同时固相线温度降低幅度更大,导致熔化温度范围扩大,钎料的填缝性能变差;对于含Sn为4%的Ag60Cu钎料,与紫铜的铺展性能以及冶金结合性能都接近于BAg72Cu钎料,并可通过压力加工制成片状钎料,可以用来替代BAg72Cu片状钎料使用。
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石磊
崔良
周飞
顾小龙
何鹏
关键词 电真空Ag-Cu钎料Sn微观组织熔化特性钎焊性能    
Abstract:Influence of Sn on microstructure, melting characteristic and brazing performance of electric vacuum Ag-Cu filler metal was studied by using scanning electronic microscope (SEM) with energy disperse spectroscopy (EDS), differential scanning calorimetry (DSC) and contrast tests. The results show that, while the addition of Sn is 4% (mass fraction,the same below), there is no brittle β-Cu phase in Ag60Cu filler metal,the effect on the processing performance is not obvious; with the increase of Sn content, the liquidus temperature of Ag60Cu filler metal decreases gradually, but the solidus temperature drops drastically,resulting in wider melting temperature range, and worse gap filling ability of filler metal. The Ag60Cu filler metal with Sn content of 4% has good spreading and metallurgical bonding abilities on copper plates, which are closer to that of BAg72Cu filler metal, and it can be processed into flake filler metal to replace the BAg72Cu flake filler metal to be used.
Key wordselectric vacuum Ag-Cu filler metal    Sn    microstructure    melting characteristic    brazing performance
收稿日期: 2014-10-27      出版日期: 2016-10-20
中图分类号:  TG425+.2  
通讯作者: 石磊(1982-),男,博士,高级工程师,主要从事银基、铜基、铝基等钎焊材料的开发及应用研究工作,联系地址:杭州市西湖区西湖科技园区西园八路北,浙江亚通焊材有限公司(310030),E-mail:shileihit@163.com     E-mail: shileihit@163.com
引用本文:   
石磊, 崔良, 周飞, 顾小龙, 何鹏. Sn对电真空Ag-Cu钎料组织和性能的影响[J]. 材料工程, 2016, 44(10): 54-59.
SHI Lei, CUI Liang, ZHOU Fei, GU Xiao-long, HE Peng. Influence of Sn on Microstructure and Performance of Electric Vacuum Ag-Cu Filler Metal. Journal of Materials Engineering, 2016, 44(10): 54-59.
链接本文:  
http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2016.10.008      或      http://jme.biam.ac.cn/CN/Y2016/V44/I10/54
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