低热膨胀聚(苯并噁唑-酰亚胺)薄膜与铜黏结性能
崔超, 袁莉莉, 尹亮, 黄玉东, 孟令辉, 杨念群, 杨士勇
Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper
Chao CUI, Lili YUAN, Liang YIN, Yudong HUANG, Linghui MENG, Nianqun YANG, Shiyong YANG
材料工程
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2022, (10): 128
-138
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DOI: 10.11868/j.issn.1001-4381.2021.001095
