电子封装低温焊料研究进展
李方樑, 甘贵生, 窦俊丰, 谢道春, 朱俊雄, 耿明利, 韩军, 杨栋华, 潘浩, 夏大权, 徐向涛
Research progress in low-temperature solders for electronic packaging
LI Fangliang, GAN Guisheng, DOU Junfeng, XIE Daochun, ZHU Junxiong, GENG Mingli, HAN Jun, YANG Donghua, PAN Hao, XIA Daquan, XU Xiangtao
材料工程
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2025, (9): 11
-28
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DOI: 10.11868/j.issn.1001-4381.2025.000001
